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Integration of Imprint-Free and Low Coercivity Ferroelectric BaTiO3 Thin Films on Silicon

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Funded by the European Union

This project has received funding from the Chips Joint Undertaking (Chips JU) from the European Union’s Horizon Europe Programme, under grant agreement 101135946. Views and opinions expressed are, however, those of the author(s) only and do not necessarily reflect those of the European Union, the European Commission or Chips JU. Neither the European Union, the European Commission nor Chips JU can be held responsible for them.

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